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Signal Processing for
Sub-Terahertz Imaging

MilliSight Technologies, Co., Ltd. possesses long-standing expertise

in sub-terahertz imaging, built upon decades of experience in semiconductor circuit and system design.

We specialize in CMOS-based millimeter-wave ICs,

including both high-efficiency transmitters and high-sensitivity receiver arrays.

Leveraging this foundation, we are developing scalable,

compact imaging platforms optimized for real-time non-invasive inspection.

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System Development

"Real-Time Reflection/Transmission Imaging System Based on Millimeter-Wave (Sub-THz) ICs"

The technology is currently being validated using food powder samples containing foreign materials such as plastic.

Real-time inspection through our system has demonstrated high detection accuracy and speed.

These capabilities are well-suited for AI-powered material screening, food safety,
and semiconductor quality control.

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*This outcome is part of MilliSight Technologies, Co., Ltd.’s project under the Advanced Materials and Components Development Program (2023–2025), supported by the Ministry of Trade, Industry and Energy (MOTIE).

Technology
Development

"CMOS-based high-resolution millimeter-wave real-time transmission imaging with mass producibility, reliability, and cost competitiveness."

Our proprietary signal processing algorithms sharpen noisy sub-terahertz images to enable accurate detection of foreign objects.

These algorithms are tailored to work in both reflection and transmission modes,
supporting fast Region of Interest (ROI) extraction even in low signal-to-noise environments.

Optimized for embedded operation on low-power MCU platforms,
our solutions are ideal for cost- and space-constrained environments such as industrial production lines.

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CMOS Millimeter-Wave High-Efficiency Transmitter IC

Comparable in performance to compound semiconductor ICs

→ IP that satisfies both marketability and performance

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Electromagnetic Image-Specific Signal Processing Algorithm

Pre-processing algorithm specialized for detecting cracks or foreign objects

→ Enables real-time processing and AI-based enhancement

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CMOS Millimeter-Wave High-Sensitivity Receiver IC

World-class CMOS receiver with mass-production capability and reliability

→ Specialized for large-area transmission imaging systems

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150 GHz Detector Module Based on 180-nm CMOS Process

Specifications

  • Integrated on-chip antenna for miniaturization and high integration

  • Rv = 1,006 kV/W, NEP = 49.69 pW/√Hz​

  • 20 × 2 detector array with staggered arrangement for improved spatial resolution​

  • Multilayer FR-4 PCB implementation

 

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